RoHS High TG FR4 Multilayer Intersect Blind And Buried Via Pcb With High Quality

Original
price: Negotiable
minimum:
Total supply:
Delivery term: The date of payment from buyers deliver within days
seat: Guangdong
Validity to: Long-term effective
Last update: 2017-11-19 09:53
Browse the number: 458
inquiry
Company Profile
 
 
Product details

Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized rohs high tg fr4 multilayer intersect blind and buried via pcb with high quality at competitive price. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have inquiry.

Products description:

Blind and buried vias PCB: Blind holes are in inner layers and buried holes are in outer layers. Normall hole size is ≥0.2mm and using mechanical drilling. Blind and buried holes to increase wiring more freedom, wiring density increased so that the circuit becomes thinner and smaller, save material and resources.

Products specification:

Layers: 8

Material /Laminate: FR4 TG170

Board thickness: 1.2mm

Copper weight: inner & outer 1oz

Finishing: ENIG

Total0bar [View All]  Related Comments
 
more»Other products

[ Products search ] [ favorites ] [ Tell friends ] [ Print ] [ Close ]